How to choose your polishing materials?

 

Polishing is the action of remove surface for the shortest time, while ensuring a high level of surface finish, fitting the application.

 

The polished substrate is the material on the surface of the device to be polished. Each substrate has its own intrinsic hardness, often measured on the Mohs scale (0 to 10).

 

The polishing process always implies a compromise between polishing speed (Removal Rate – RR) and surface finish. This will depend on the nature of the substrate to polish and especially its intrinsic hardness, and the polishing technique used.